CAMILLE CHISM, CPP FELLOW
Packaging Consultant, C2 Packaging Consulting
Camille Chism, CPP, Fellow, has a diverse background in leadership, engineering, sales, logistics, technology development, supply chain management, lean manufacturing, warehousing, design, test methods, project teams and engineering management.
Her experience includes a variety of industries including automotive, food, distribution, pharmaceutical, and technology at: Ingersoll Rand, Johnson Controls, Fiat Chrysler, Weyerhaeuser, Hewlett-Packard, Lucent Technologies, UPS, ConAgra, HAVI, and Mondelez.
Camille is currently Principal at C2 Packaging Consulting, a consultancy specializing in packaging design, supply chain and launch management.
A lifetime CPP, inducted into the IoPP College of Fellows in 2013, Camille received an MS in Packaging Science from Rochester Institute of Technology, earning a 4.0 GPA, and holds a BS in Packaging from Michigan State University.
Her accomplishments include: a patent for the design of an injection molded dispenser, various corporate awards, and leadership training from Cardinal Stritch University.
Camille has been active in numerous packaging industry events, including the Institute of Packaging Professionals (IoPP) since 1990, serving in leadership positions at the chapter level and the national board. She also participated in working groups, standards teams, and planning committees for the Automotive Industry Action Group (AIAG).
Speaking engagements include: 2010 IoPP Packaging Summit, the Simposio Internacional Industria Automotriz, Automotive Logistics Global Conferences, Global SCM Leaders Conference, Auto Logistics Leader Conference, and a guest lecturer in the Industrial Engineering Department at the University of Nebraska, Lincoln.